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[Infographic] Automotive Intelligence Driven by Small Packages Under the Hood

Other than the smartphone and tablet, which device is also mobile and electronic? Cars are comprised of many important mechanical parts, many of which have been at their core for years now. But cars also can be considered as highly sophisticated electronic systems, hence semiconductors constituting an essential section.

 

As the graphics show below, semiconductor solutions are used in a wide array of automotive applications such as the camera and sensing system, dashboard, IVI (In-Vehicle Infotainment) system, ADAS (Advanced Driver Assistant System), autonomous driving central computing system and gateway. Semiconductors will be used even more extensively in the future, especially with the potential introduction of autonomous driving.

 

 

Samsung has been continuously cooperating with leading automobile manufacturers to make its semiconductor technologies available in the industry’s latest automobiles as well as next-generation cars. The company has participated in the Audi Progressive SemiConductor Program (PSCP) since 2015 with its advanced memory solutions and Exynos processors.

 

With its multiple operating system compatibility and support for multi-display, Samsung’s flagship Exynos processors enable powerful computing and graphics processing performance for today’s automobiles with highly graphical user interfaces. Along with its Exynos offerings, Samsung also plans to develop a wide array of logic IC solutions for upcoming automotive applications. Images sensors, working as the eyes of future vehicles, will have further improved frame rate and light sensitivity for thorough monitoring and sensing the driving environment.

 

When it comes to memory solutions, Samsung provides its high-performance, high-density LPDDR4 /LPDDR4X and GDDR6 DRAM lineups to address ever increasing demand for higher data bandwidth. For secure data storage, Samsung offers advanced eMMC and UFS solutions. All of these Samsung semiconductor solutions for automotive applications guarantee the highest performance levels among their kinds and are designed to endure tough environments inside the automobiles such as sudden temperature changes and continuous vibration.

 

Also offered by Samsung are LED components for interior and exterior lighting of automobiles such as cluster indicator lighting, headlamps and turn signal lamps. Based on upcoming technologies like pixel lighting, Samsung will be able to provide LED packages and modules that will enable more sophisticated and reliable lighting solutions.

Samsung Begins Mass Production of 10nm-class 16Gb LPDDR4X DRAM for Automobiles

Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing 10-nanometer (nm)-class* 16-gigabit (Gb) LPDDR4X DRAM for automobiles. The latest LPDDR4X features high performance and energy efficiency while significantly raising the thermal endurance level for automotive applications that often need to operate in extreme environments. The 10nm-class DRAM will also enable the industry’s fastest automotive DRAM-based LPDDR4X interface with the highest density.

 

“The 16Gb LPDDR4X DRAM is our most advanced automotive solution yet, offering global automakers outstanding reliability, endurance, speed, capacity and energy efficiency, ,” said Sewon Chun, senior vice president of memory marketing at Samsung Electronics. “Samsung will continue to closely collaborate with manufacturers developing diverse automotive systems, in delivering premium memory solutions anywhere.”

 

Moving a step beyond its 20nm-class ‘Automotive Grade 2’ DRAM, which can withstand temperatures from -40°C to 105°C, Samsung’s 16Gb LPDDR4X is Automotive Grade 1-compliant, raising the high-end threshold to 125°C. By more than satisfying the rigorous on-system thermal cycling tests of global auto manufacturers, the 16Gb LPDDR4X has enhanced its reliability for a wide variety of automotive applications in many of the world’s most challenging environments.

 

Adding to the degree of reliability under high temperatures, production at an advanced 10nm-class node is key to enabling the 16Gb LPDDR4X to deliver its leading-edge performance and power efficiency. Even in environments with extremely high temperatures of up to 125°C, its data processing speed comes in at 4,266 megabits per second (Mbps), a 14 percent increase from the 8Gb LPDDR4 DRAM that is based on 20nm process technology, and the new memory also registers a 30 percent increase in power efficiency.

 

Along with a 256 gigabyte (GB) embedded Universal Flash Storage (eUFS) drive announced in February, Samsung has expanded its advanced memory solution lineup for future automotive applications with the 10nm-class 16Gb LPDDR4X DRAM, commercially available in 12Gb, 16Gb, 24Gb and 32Gb capacities. While extending its 10nm-class DRAM offerings, the company also plans on bolstering technology partnerships for automotive solutions that include vision ADAS (Advanced Driver Assistance Systems), autonomous driving, infotainment systems and gateways.

 

*Editor’s Note:  10nm-class is a process node between 10 and 19 nanometers

Samsung Begins Mass Production of 256GB Embedded Universal Flash Storage for Automotive Applications

Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production of a 256-gigabyte (GB) embedded Universal Flash Storage (eUFS) solution with advanced features based on automotive specifications from the JEDEC UFS 3.0 standard, for the first time in the industry.

 

Following the memory breakthrough of the automotive industry’s first 128GB eUFS in September, 2017, Samsung’s 256GB eUFS is now being shipped to automotive manufacturers preparing the market for Advanced Driver Assistance Systems (ADAS), next-generation infotainment systems and new-age dashboards in luxury vehicles.

 

As thermal management is crucial for automotive memory applications, Samsung’s 256GB eUFS extends the temperature range to between -40°C and 105°C for both operational and power-saving modes. Warranties for conventional embedded multimedia card (eMMC) 5.1 solutions generally cover -25°C to 85°C for vehicles in operation and -40°C to 85°C when in idle or power-saving mode,

 

“With the new temperature threshold for automobile warranties, major automotive manufacturers can now design-in memory that’s even well suited for extreme environments and know they will be getting highly reliable performance,” said Kyoung Hwan Han, vice president of NAND marketing at Samsung Electronics. “Starting with high-end vehicles, we expect to expand our business portfolio across the entire automotive market, while accelerating growth in the premium memory segment.”

 

 

Samsung’s 256GB eUFS not only can easily endure the new temperature specification, despite the heat-sensitive nature of memory storage, but also through its temperature notification feature, a sensor will notify the host application processor (AP) when the device temperature exceeds 105°C or any pre-set level. The AP would then regulate its clock speed to lower the temperature to an acceptable level.

 

Sequential reads for the 256GB eUFS can reach 850 megabytes per second (MB/s), which is at the high end of the current JEDEC UFS 2.1 standard, and random read operations come in at 45,000 IOPS. In addition, a data refresh feature speeds up processing and enables greater system reliability by relocating older data to other less-used cells.

 

The temperature notification, developed by Samsung, and data refresh features are included in UFS specification, version 3.0, which was announced last month by JEDEC, a global semiconductor standards organization.

 

Samsung plans to bolster its technology partnerships with global automakers and component providers, and continue expanding its eUFS line-up with an aim to lead the premium memory market.

Samsung Starts Producing Industry’s First Universal Flash Storage For Next-Generation Automotive Applications

Samsung Electronics, the world leader in advanced memory technology, today announced that it is introducing the industry’s first embedded Universal Flash Storage (eUFS) solution for use in next-generation automotive applications. Consisting of 128-gigabyte (GB) and 64GB versions, the new eUFS solution has been designed for advanced driver-assistance systems (ADAS), next-generation dashboards and infotainment systems that provide comprehensive connected features for drivers and passengers worldwide.

 

“We are taking a major step in accelerating the introduction of next-generation ADAS and automotive infotainment systems by offering the industry’s first eUFS solution for the market much earlier than expected,” said Jinman Han, Senior Vice President of Memory Product Planning & Application Engineering at Samsung Electronics. “Samsung is taking the lead in the growth of the memory market for sophisticated automotive applications, while continuing to deliver leading-edge UFS solutions with higher performance, density and reliability.”

 

Embedded UFS solutions have been used in a variety of mobile applications since early 2015, when Samsung introduced 128GB embedded memory based on the JEDEC UFS 2.0 standard, for the first time in the industry. Since then, the high performance and proven quality of UFS has led to its wide adoption in large numbers of mobile devices from flagship smartphones initially, to also now in mid-market smartphones.

 

Configured on the most up-to-date UFS standard (JEDEC UFS 2.1), the new Samsung eUFSwill provide advanced data transfer speeds and robust data reliability. For example, the new Samsung 128GB eUFS can read data at up to 850 megabytes per second (MB/s), which is approximately 3.4 times faster than the 250MB/s read speed of today’s eMMC 5.0 solutions. It also offers about 6.3 times faster random reading than eMMC at 45,000 IOPS. This will contribute to significantly enhanced performance in upcoming automotive infotainment systems for better managing audio content, increasing navigation responsiveness, accessing Internet-enabled traffic and weather reports, improving handling of hands-free voice commands, and speeding up rear-seat social media interplay.

 

The new eUFS solution also features an efficient and reliable error-handling process, which is essential for next-generation in-vehicle infotainment. Based on the MIPI UniPro®* protocol, the eUFS enables detecting and recovering from I/O error on hardware layers, without having to involve the host software or restarting tasks.

 

In addition, the Samsung eUFS supports advanced data refresh and temperature notification features for superior system reliability. The advanced data refresh operation allows a choice of refresh methods, and provides information on the refresh unit, frequency and progress for the host device’s control. This enables optimal data reliability, an essential element of automotive applications.

 

When it comes to thermal management, the Samsung eUFS equips the temperature sensor inside the controller to enable highly reliable device temperature control. This prevents the eUFS from crossing well-defined upper and lower temperature boundaries, thereby allowing its NAND cells to flawlessly function within a tough automotive temperature environment.

 

In light of the eUFS’ high performance and reliability, Samsung expects rapid adoption in the automotive market. Samsung will continue to satisfy the growing storage needs of leading automotive manufacturers by offering a variety of advanced eUFS lineups, while more thoroughly addressing the ever-increasing demand for leading-edge memory solutions in other market segments, too.

 

 

* Editor’s Note: MIPI UniPro® is a general purpose, unified protocol that services a wide range of interface needs in mobile and connected devices. The interface was developed by the MIPI Alliance UniPro Working Group and has been available since 2007. Its current version, v1.61, was released in 2015. For more information, please visit https://mipi.org.

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