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[Infographic] Semiconductor Technology: The Essential Building Blocks of Mobile Innovation

Hidden under the cover of today’s advanced mobile devices, there are innovative semiconductor and LED solutions built in to enable new features and technologies consumers are continuously seeking.

 

With its decades-long technology innovation and expertise, Samsung Electronics’ Device Solutions Division provides an extensive range of semiconductor and LED solutions to meet the ever-increasing requirements of the mobile industry. While not always visible to end users, Samsung’s component solutions have been utilized comprehensively to raise the level of what’s possible for mobile devices, and help enable a world of difference in performance and user experience.

 

Here, we go under the hood, to take a look at some of these solutions.

 

 

 

Leading-edge Processor and Memory Solutions for a Seamless User Experience

One prime example of Samsung’s component innovation is the Exynos 9 Series 9810 processor, built upon the company’s latest 2nd generation 10-nanometer LPP process technology. The processor delivers powerful mobile computing performance with its 3rd generation CPU and seamless connectivity with a 6-mode/all network supporting 1.2Gbps DL 6CA Cat.18 LTE modem.

 

Working in tandem with the Exynos processor is the LPDDR4X memory chip, the industry’s most up-to-date mobile DRAM solution that provides breakthrough RAM performance and energy efficiency. Available in a compact package offering up to 8-gigabyte (GB) capacity, the LPDDR4X enables prompt multitasking and data processing for advanced mobile applications such as 4K UHD video recording and virtual computing.

 

Also, under today’s heavy multimedia and content use environment, users can safely store their valuable data on Samsung eUFS, an embedded high-speed mobile storage solution for flagship devices. Based on Samsung’s proprietary V-NAND technology, the eUFS features ultrafast data read and download speeds as well as abundant storage capacity as high as 512GB.

 

 

Enhanced Imaging and Video Features

The Samsung ISOCELL Fast 2L3, a 3-stack fast readout image sensor with an embedded 2Gb LPDDR4 memory, enables significantly enhanced mobile imaging and video functionality with the ability to record at 960fps for brand new features like stunning slow-motion video shooting. Also among Samsung’s broad image sensor lineup is a front-facing ISOCELL Bright image sensor, which enables high-quality selfies on mobile devices even in very low light settings, using leading-edge pixel technologies.

 

In addition, Samsung’s Patterned Lens-Integrated Flash LED component, positioned next to the rear camera, enhances the quality of images even further with its high luminous intensity and uniformity.

 

Reinforced Security, Power and Touch Command Management 

Samsung continues to reinforce security, power, and touch command management on mobile devices through an array of component solutions. For example, its new iris sensor enables a fast yet highly secure option to unlock or authorize application access, and the touch controller enables instant feedback at the tap of one’s finger. Last but not the least, Samsung’s power management IC delivers a stable supply of power, supporting devices to perform with optimal energy efficiency.

 

As mobile devices continue to evolve, Samsung Electronics’ Device Solutions Division will remain committed to developing and providing its customers with semiconductor and LED technology with distinct value, and providing the best in performance, capacity, functionality and energy efficiency.

Samsung Begins Mass Production of 256GB Embedded Universal Flash Storage for Automotive Applications

Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production of a 256-gigabyte (GB) embedded Universal Flash Storage (eUFS) solution with advanced features based on automotive specifications from the JEDEC UFS 3.0 standard, for the first time in the industry.

 

Following the memory breakthrough of the automotive industry’s first 128GB eUFS in September, 2017, Samsung’s 256GB eUFS is now being shipped to automotive manufacturers preparing the market for Advanced Driver Assistance Systems (ADAS), next-generation infotainment systems and new-age dashboards in luxury vehicles.

 

As thermal management is crucial for automotive memory applications, Samsung’s 256GB eUFS extends the temperature range to between -40°C and 105°C for both operational and power-saving modes. Warranties for conventional embedded multimedia card (eMMC) 5.1 solutions generally cover -25°C to 85°C for vehicles in operation and -40°C to 85°C when in idle or power-saving mode,

 

“With the new temperature threshold for automobile warranties, major automotive manufacturers can now design-in memory that’s even well suited for extreme environments and know they will be getting highly reliable performance,” said Kyoung Hwan Han, vice president of NAND marketing at Samsung Electronics. “Starting with high-end vehicles, we expect to expand our business portfolio across the entire automotive market, while accelerating growth in the premium memory segment.”

 

 

Samsung’s 256GB eUFS not only can easily endure the new temperature specification, despite the heat-sensitive nature of memory storage, but also through its temperature notification feature, a sensor will notify the host application processor (AP) when the device temperature exceeds 105°C or any pre-set level. The AP would then regulate its clock speed to lower the temperature to an acceptable level.

 

Sequential reads for the 256GB eUFS can reach 850 megabytes per second (MB/s), which is at the high end of the current JEDEC UFS 2.1 standard, and random read operations come in at 45,000 IOPS. In addition, a data refresh feature speeds up processing and enables greater system reliability by relocating older data to other less-used cells.

 

The temperature notification, developed by Samsung, and data refresh features are included in UFS specification, version 3.0, which was announced last month by JEDEC, a global semiconductor standards organization.

 

Samsung plans to bolster its technology partnerships with global automakers and component providers, and continue expanding its eUFS line-up with an aim to lead the premium memory market.

Samsung Starts Producing Industry’s First Universal Flash Storage For Next-Generation Automotive Applications

Samsung Electronics, the world leader in advanced memory technology, today announced that it is introducing the industry’s first embedded Universal Flash Storage (eUFS) solution for use in next-generation automotive applications. Consisting of 128-gigabyte (GB) and 64GB versions, the new eUFS solution has been designed for advanced driver-assistance systems (ADAS), next-generation dashboards and infotainment systems that provide comprehensive connected features for drivers and passengers worldwide.

 

“We are taking a major step in accelerating the introduction of next-generation ADAS and automotive infotainment systems by offering the industry’s first eUFS solution for the market much earlier than expected,” said Jinman Han, Senior Vice President of Memory Product Planning & Application Engineering at Samsung Electronics. “Samsung is taking the lead in the growth of the memory market for sophisticated automotive applications, while continuing to deliver leading-edge UFS solutions with higher performance, density and reliability.”

 

Embedded UFS solutions have been used in a variety of mobile applications since early 2015, when Samsung introduced 128GB embedded memory based on the JEDEC UFS 2.0 standard, for the first time in the industry. Since then, the high performance and proven quality of UFS has led to its wide adoption in large numbers of mobile devices from flagship smartphones initially, to also now in mid-market smartphones.

 

Configured on the most up-to-date UFS standard (JEDEC UFS 2.1), the new Samsung eUFSwill provide advanced data transfer speeds and robust data reliability. For example, the new Samsung 128GB eUFS can read data at up to 850 megabytes per second (MB/s), which is approximately 3.4 times faster than the 250MB/s read speed of today’s eMMC 5.0 solutions. It also offers about 6.3 times faster random reading than eMMC at 45,000 IOPS. This will contribute to significantly enhanced performance in upcoming automotive infotainment systems for better managing audio content, increasing navigation responsiveness, accessing Internet-enabled traffic and weather reports, improving handling of hands-free voice commands, and speeding up rear-seat social media interplay.

 

The new eUFS solution also features an efficient and reliable error-handling process, which is essential for next-generation in-vehicle infotainment. Based on the MIPI UniPro®* protocol, the eUFS enables detecting and recovering from I/O error on hardware layers, without having to involve the host software or restarting tasks.

 

In addition, the Samsung eUFS supports advanced data refresh and temperature notification features for superior system reliability. The advanced data refresh operation allows a choice of refresh methods, and provides information on the refresh unit, frequency and progress for the host device’s control. This enables optimal data reliability, an essential element of automotive applications.

 

When it comes to thermal management, the Samsung eUFS equips the temperature sensor inside the controller to enable highly reliable device temperature control. This prevents the eUFS from crossing well-defined upper and lower temperature boundaries, thereby allowing its NAND cells to flawlessly function within a tough automotive temperature environment.

 

In light of the eUFS’ high performance and reliability, Samsung expects rapid adoption in the automotive market. Samsung will continue to satisfy the growing storage needs of leading automotive manufacturers by offering a variety of advanced eUFS lineups, while more thoroughly addressing the ever-increasing demand for leading-edge memory solutions in other market segments, too.

 

 

* Editor’s Note: MIPI UniPro® is a general purpose, unified protocol that services a wide range of interface needs in mobile and connected devices. The interface was developed by the MIPI Alliance UniPro Working Group and has been available since 2007. Its current version, v1.61, was released in 2015. For more information, please visit https://mipi.org.

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