Samsung Electronics, the world leader in advanced semiconductor technology, today shared its vision in India’s smartphone market and lineup of advanced components at its fourth Samsung Mobile Solutions Forum (SMSF) in New Delhi.
With India burgeoning as the world’s fastest growing smartphone market and poised as a major hub for smartphone manufacturing, the country’s mobile industry has been experiencing an extraordinary shift in all aspects of the ecosystem that show new opportunities as it progresses.
More than 300 industry experts attended the forum that included global mobile manufacturers, OEM (original equipment manufacturer) companies, component partners and analysts, and were encouraged to collaborate on ways to tread “Together Toward Tomorrow” within India’s exciting mobile landscape.
As a global technology leader and total solutions provider, Samsung emphasized that its extensive experience in supporting worldwide brands and growing local presence will provide both deep insight and differentiated value to its partners.
“Innovation is our core strength that enables us to bring technologically advanced solutions,” said Haejin Park, Vice President and Head of Device Solutions in Southeast Asia, Samsung Electronics. “We strongly believe that no achievement big or small is possible without the collective effort of all stakeholders and Samsung is committed to being a long-term partner on the road to success.”
A comprehensive portfolio of Samsung’s component solutions were highlighted at SMSF that included;
Exynos 7 Series mobile processors for a wide range of product segments such as Exynos 9610 for high-end smartphones with intelligent vision and image processing, and Exynos 7885, 7904 and 7905 for powerful performance in more affordable devices.
Exynos Modem 5100 that fully complies with the most current 5G standard and supports multi-mode communication in a single-chip design.
Internet of Things (IoT) solutions from the efficient and reliable Exynos i S111 for narrowband applications to ARTIK end-to-end solutions
ISOCELL image sensors optimized for various device requirements, such as the latest ISOCELL Plus that delivers exceptionally bright and vivid picture qualities, and ISOCELL Plug & Play solution for easy development of pre-tuned camera modules.
Near Field Communication (NFC) and Power Management IC (PMIC) for mobile devices and accessories
LPDDR5-based mobile DRAM built on 10-nanometer (nm)-class process technology that will be powering UHD mobile devices as well as artificial intelligence (AI) and machine learning applications.
Samsung first held its components forum in 2015 that focused on its lineup of image sensors. Recognizing the opportunities in India’s mobile market since then, the company has been expanding the scope of its offerings showcased at the Samsung Mobile Solutions Forum each year.
Samsung Electronics, a world leader in advanced semiconductor technology, today announced its new narrowband (NB) Internet of Things (IoT) solution, Exynosi S111.
The new NB-IoT solution offers extremely wide coverage, low-power operation, accurate location feedback and strong security, optimized for today’s real-time tracking applications such as safety wearables or smart meters. The solution includes a modem, processor, memory and Global Navigation Satellite System (GNSS) into a single chip design to enhance efficiency and flexibility for connected device manufacturers.
“IoT will be able to evolve to offer new features beyond the conventional household space with IoT-dedicated solutions that present a broad range of opportunities,” said Ben Hur, vice president of System LSI marketing at Samsung Electronics. “Exynosi S111’s highly secure and efficient communication capabilities will bring more exciting NB-IoT applications to life.”
As IoT grows to be a part of our everyday lives, some connected devices share useful information instantly in high volumes, but some transmit data in small nuggets over a long period of time. Popular radio connectivity systems such as Bluetooth and ZigBee are suitable for short-range scenarios within confined spaces such as in the home or a building, and broadband communications are commonly used for mobile devices that demand high data rates. On the other hand, NB-IoT supports applications that require reliable low-power communication and wide-range coverage for small-sized data.
To cover long distances with high reliability, as a standard, NB-IoT adopts a data retransmission mechanism that continuously transmits data until a successful transfer, or up to a set number of retransmits. With a high number of these retransmit sessions, the S111 is able to cover the distance of 10-kilometers (km) or more.
Exynosi S111 incorporates a modem capable of LTE Rel. 14 support that can transmit data at 127-kilobits-per-second (kbps) for downlink and 158kbps uplink, and can operate in standalone, in-band and guard-band deployments.
For long standby periods, the S111 utilizes power saving mode (PSM) and expanded discontinuous reception (eDRX), which keeps the device dormant for long periods of time of 10 years and more, depending on application and use-cases. Exynos i S111 also has an integrated Global Navigation Satellite System (GNSS) and supports Observed Time Difference of Arrival (OTDOA), a positioning technique using cellular towers, for highly accurate and seamless real-time tracking.
Transmitted data are kept secure and private with the S111, as the solution utilizes a separate Security Sub-System (SSS) hardware block along with a Physical Unclonable Function (PUF) that creates a unique identity for each chipset.
Following the successful launch of the company’s first IoT solution, Exynosi T200, in 2017, Samsung plans to continue expanding the ‘Exynosi‘ lineup with offerings especially tailored for narrowband networks.
Consumers are a step closer to the commercialization of the new 5G technology-based services including autonomous driving applications, Virtual Reality (VR) and Internet of Things (IoT). Samsung Electronics has unveiled the Exynos Modem 5100, a multi-mode communication chip developed in line with 5G mobile communication standards. The end-user equipment prototype embedded with the new modem successfully passed the 5G access network-based over-the-air (OTA) 5G-NR (New Radio) data call test under a wireless environment utilizing Samsung’s 5G base station. Find out more about the Exynos Modem 5100, the accelerator of 5G commercialization, in the infographic below.
Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has developed Exynos Modem 5100, the industry’s first 5G modem that is fully compatible with 3rd Generation Partnership Project (3GPP) Release 15 (Rel.15), the most up-to-date standard specification for 5G New Radio (5G-NR). Built on power-efficient 10-nanometer (nm) process technology, the new modem also supports legacy radio access technologies designed into a single chip.
“Samsung’s leadership in communication technologies and market-proven knowledge allowed us to develop the industry’s first 5G modem, the Exynos Modem 5100, which fully complies with the latest 3GPP standards,” said Dr. Inyup Kang, president and head of System LSI Business at Samsung Electronics. “As the industry prepares the shift toward 5G, Samsung will continue to drive the growth of innovative ideas and new services in mobile applications and other emerging industries.”
Samsung successfully conducted an over-the-air (OTA) 5G-NR data call test under a wireless environment utilizing a 5G base station and 5G end-user equipment prototype embedded with Exynos Modem 5100. As the test simulated real-world cellular network conditions, this will ensure faster development and commercialization of 5G mobile devices that adopt this new modem. Samsung is also working closely with a number of global mobile carriers and partners to quickly bring 5G mobile communications to the market.
The Exynos Modem 5100 supports both sub-6GHz and mmWave spectrums specified in 3GPP’s 5G standard as well as legacy networks, including 2G GSM/CDMA, 3G WCDMA, TD-SCDMA, HSPA, and 4G LTE, with a single chip solution. As 5G is expected to be first deployed over existing network infrastructures, commercial implementation will benefit from the single-chip design that maximizes data transmission efficiency and reliability between other communication networks.
The modem delivers a maximum downlink speed of up to 2-gigabits per second (Gbps) in 5G’s sub-6-gigahertz (GHz) settings and 6Gbps in mmWave settings, which are about 1.7 and five times the data transfer speeds of its predecessor respectively. Fast and stable data communication can also be secured in 4G networks with the downlink speed of 1.6Gbps.
5G’s capability to transmit large-capacity data and real-time low-latency communication is expected to bring new user experiences not only in mobile but also in areas such as the Internet of Things (IoT), ultra-high resolution videos, holograms, real-time artificial intelligence (AI) and autonomous driving.
Exynos Modem 5100 is also offered with radio frequency IC (RFIC), Envelope Tracking (ET) and power management IC (PMIC) solutions, and will be available to customers by the end of 2018.
More information about Samsung’s Exynos products can be found at: http://www.samsung.com/exynos.
Samsung Electronics, a world leader in advanced semiconductor technology, today announced that its 16-gigabit (Gb) Graphics Double Data Rate 6 (GDDR6) memory is being used in NVIDIA’s new Turing architecture-based Quadro® RTX GPUs.
Thanks to Samsung’s industry-leading 16Gb GDDR6 memory, end users can expect improved performance and energy efficiency in the widest array of graphics-intensive applications, including computer-aided design (CAD), digital content creation (DCC) and scientific visualization applications. Samsung’s 16Gb GDDR6 can also be used in rapidly growing fields such as 8K Ultra HD video processing, virtual reality (VR), augmented reality (AR) and artificial intelligence (AI).
Samsung is leading the graphics market by offering the first available 16Gb GDDR6, which doubles the device capacity of the company’s 20-nanometer 8Gb GDDR5 memory. The new solution performs at a 14-gigabits-per-second (Gbps) pin speed with data transfers of 56 gigabytes per second (GB/s), which represents a 75 percent increase over 8Gb GDDR5 with its 8Gbps pin speed.
Moreover, Samsung’s GDDR6 consumes 35 percent less power than that required by the leading GDDR5 graphics solutions. Using a state-of-the-art low-power circuit design, the Samsung 16Gb GDDR6 operates at 1.35V compared to the 1.55V consumed by GDDR5 commonly found in the market today.
“It’s a tremendous privilege to have been selected by NVIDIA to launch Samsung’s 16Gb GDDR6, and to have enjoyed the full confidence of their design team in making our key contribution to the NVIDIA Quadro RTX GPUs,” said Jim Elliott, Corporate Senior Vice President at Samsung Semiconductor.
Unveiled today by NVIDIA founder and CEO Jensen Huang at the annual SIGGRAPH conference, the NVIDIA® Quadro RTX 8000, Quadro RTX 6000 and Quadro RTX 5000 GPUs bring hardware-accelerated ray tracing, AI, advanced shading and simulation to creative professionals. The new Quadro RTX GPUs will be available worldwide starting in October 2018.
“Our new Quadro RTX professional GPUs are the industry’s first to integrate Samsung’s high-speed GDDR6 memory technology,” said Bob Pette, Vice President, Professional Visualization, NVIDIA. “With up to 48GB capacity, our GPUs accommodate the largest models and scenes, and increase application performance, enabling professionals to design, develop and deliver much better results with faster turnaround.”
Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing the industry’s first 2nd-generation of 10-nanometer-class* (1y-nm), LPDDR4X (Low Power, Double Data Rate, 4X) DRAM to improve the efficiency and lower the battery drain of today’s premium smartphones and other mobile applications.
Compared to the mobile DRAM memory chips most used in current flagship mobile devices (1x-nm 16Gb LPDDR4X), the 2nd– generation LPDDR4X DRAM features up to a 10 percent power reduction while maintaining the same data rate of 4,266 megabits per second (Mb/s).
“The advent of 10nm-class mobile DRAM will enable significantly enhanced solutions for next-generation, flagship mobile devices that should first hit the market late this year or the first part of 2019.” said Sewon Chun, senior vice president of Memory Sales & Marketing at Samsung Electronics. “We will continue to grow our premium DRAM lineup to lead the ‘high-performance, high capacity, and low power’ memory segment to meet the market demand and strengthen our business competitiveness.”
Samsung will be expanding its premium DRAM lineup that is based on the 1y-nm process by more than 70 percent. This initiative began with mass producing the first 10nm-class 8Gb DDR4 server DRAM last November and continues with this 16Gb LPDDR4X mobile memory chip only eight months later.
Samsung said that it has created an 8GB LPDDR4X mobile DRAM package by combining four of the 10nm-class 16Gb LPDDR4X DRAM chips (16Gb=2GB). This four-channel package can realize a data rate of 34.1GB per second and its thickness has been reduced more than 20 percent from the 1st-gen package, enabling OEMs to design slimmer yet more effective mobile devices.
With its LPDDR4X advancements, Samsung will be rapidly expanding its share of mobile DRAM in the market by providing a variety of high-capacity products, including 4GB, 6GB and 8GB LPDDR4X packages.
In line with its roll-out of 10nm-class LPDDR4X, Samsung has started operating a new DRAM production line in Pyeongtaek, Korea, to assure a stable supply of all mobile DRAM chips, in response to the increasing demand.
*10nm-class denotes a process technology node somewhere between 10 and 19 nanometers.
TIMELINE: Samsung’s Mass Production History of Mobile DRAM since 2012
Samsung Electronics, the world leader in advanced memory technology, today announced that it has successfully developed the industry’s first 10-nanometer (nm) class* 8-gigabit (Gb) LPDDR5 DRAM. Since bringing the first 8Gb LPDDR4 to mass production in 2014, Samsung has been setting the stage to transition to the LPDDR5 standard for use in upcoming 5G and Artificial Intelligence (AI)-powered mobile applications.
The newly-developed 8Gb LPDDR5 is the latest addition to Samsung’s premium DRAM lineup, which includes 10nm-class 16Gb GDDR6 DRAM (in volume production since December 2017) and 16Gb DDR5 DRAM (developed in February).
“This development of 8Gb LPDDR5 represents a major step forward for low-power mobile memory solutions,” said Jinman Han, senior vice president of Memory Product Planning & Application Engineering at Samsung Electronics. “We will continue to expand our next-generation 10nm-class DRAM lineup as we accelerate the move toward greater use of premium memory across the global landscape.”
The 8Gb LPDDR5 boasts a data rate of up to 6,400 megabits per second (Mb/s), which is 1.5 times as fast as the mobile DRAM chips used in current flagship mobile devices (LPDDR4X, 4266Mb/s). With the increased transfer rate, the new LPDDR5 can send 51.2 gigabytes (GB) of data, or approximately 14 full-HD video files (3.7GB each), in a second.
The 10nm-class LPDDR5 DRAM will be available in two bandwidths – 6,400Mb/s at a 1.1 operating voltage (V) and 5,500Mb/s at 1.05V – making it the most versatile mobile memory solution for next-generation smartphones and automotive systems. This performance advancement has been made possible through several architectural enhancements. By doubling the number of memory “banks” – subdivisions within a DRAM cell – from eight to 16, the new memory can attain a much higher speed while reducing power consumption. The 8Gb LPDDR5 also makes use of a highly advanced, speed-optimized circuit architecture that verifies and ensures the chip’s ultra-high-speed performance.
To maximize power savings, the 10nm-class LPDDR5 has been engineered to lower its voltage in accordance with the operating speed of the corresponding application processor, when in active mode. It also has been configured to avoid overwriting cells with ‘0’ values. In addition, the new LPDDR5 chip will offer a ‘deep sleep mode’, which cuts the power usage to approximately half the ‘idle mode’ of the current LPDDR4X DRAM. Thanks to these low-power features, the 8Gb LPDDR5 DRAM will deliver power consumption reductions of up to 30 percent, maximizing mobile device performance and extending the battery life of smartphones.
Based on its industry-leading bandwidth and power efficiency, the LPDDR5 will be able to power AI and machine learning applications, and will be UHD-compatible for mobile devices worldwide.
Samsung, together with leading global chip vendors, has completed functional testing and validation of a prototype 8GB LPDDR5 DRAM package, which is comprised of eight 8Gb LPDDR5 chips. Leveraging the cutting-edge manufacturing infrastructure at its latest line in Pyeongtaek, Korea, Samsung plans to begin mass production of its next-generation DRAM lineups (LPDDR5, DDR5 and GDDR6) in line with the demands of global customers.
*Editor’s Note: 10nm-class is a process node between 10 and 20 nanometers
Self-driving cars sit at the intersection of artificial intelligence and the automobile industry, presenting an exciting new opportunity for transportation. While the commercialization of autonomous driving awaits technological refinement and regulation, Samsung Electronics’ semiconductor production lines are already utilizing systems that share similarities with self-driving technologies. These systems feature the use of Overhead Hoist Transport (OHT) devices that are responsible for carrying materials automatically around the manufacturing facility.
OHT: A Key Component of Automation
The OHT vehicle’s passengers are “wafers”. In semiconductor manufacturing, wafers are thin round slices of a mono-crystalline silicon ingot, which serve as major components in the fabrication of integrated circuits. A single wafer will undergo hundreds of physical and chemical steps before becoming a completed product and it is essential to keep delivering these wafers to the equipment more efficiently. To facilitate this, OHT devices are used to deliver wafers automatically to each stage in the production process. After the wafers are loaded into a special container, called a “FOUP” (Front Opening Unified Pod), the OHT vehicles move them around complex routes along the overhead rails.
OHT vehicles travel along a number of different routes and often encounter other vehicles at points where the rails cross or fork. To ensure a steady and collision-free flow, each OHT vehicle and crossing point have their own sensors. When these sensors detect more than two OHT vehicles in a designated section, the OHT devices can automatically slow down to guarantee safe transportation. Among the many technologies adopted by the semiconductor manufacturing facility, this is a good example of the simultaneous utilization of its software and hardware capabilities.
What is more, just as the dashboard of a car displays real-time gauges and alerts, the OHT system has many sensors that monitor the condition of its machine parts, offering diagnostics on parts that need to be inspected or replaced.
The use of automated OHT equipment contributes to enhancing production efficiency, like a well-designed transport system guarantees the smooth flow of traffic across a city. The OHT vehicles can travel on average up to 5m/s (18km/h) along straight tracks and up to 1m/s (3.6km/h) along curved tracks.
Information about OHT vehicles is delivered wirelessly to a central server installed in an integrated control system, which builds up a complete picture of every machine’s movements in the semiconductor manufacturing facility, much like a traffic control center overseeing the traffic flow of an entire city. The integrated control system monitors not only the overall flow of OHT vehicles but also the real-time information on the wait times of each individual vehicle. The system also makes sure vehicles move along designated pathways within their scheduled times. In addition, the system determines the fastest route for each vehicle and can even control the movements of a specific vehicle.
In many aspects, the OHT system offers clues about the future offered by self-driving cars. It carries its passengers faster and more efficiently without drivers. By developing these autonomous vehicles, Samsung Electronics will continue to build and operate smarter semiconductor manufacturing facilities.
Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing its fifth-generation V-NAND memory chips with the fastest data transfers now available. In the industry’s first use of the ‘Toggle DDR 4.0’ interface, the speed for transmitting data between storage and memory over Samsung’s new 256-gigabit (Gb) V-NAND has reached 1.4-gigabits per second (Gbps), a 40-percent increase from its 64-layer predecessor.
The energy efficiency of Samsung’s new V-NAND remains comparable to that of the 64-layer chip, primarily because the operating voltage has been reduced from 1.8 volts to 1.2 volts. The new V-NAND also has the fastest data write speed to date at 500-microseconds (μs), which represents about a 30-percent improvement over the write speed of the previous generation, while the response time to read-signals has been significantly reduced to 50μs.
Packed inside Samsung’s fifth-generation V-NAND are more than 90 layers of ‘3D charge trap flash (CTF) cells,’ the largest amount in the industry, stacked in a pyramid structure with microscopic channel holes vertically drilled throughout. These channel holes, which are only a few hundred-nanometers (nm)-wide, contain more than 85 billion CTF cells that can store three bits of data each. This state-of-the-art memory fabrication is the result of several breakthroughs that include advanced circuit designs and new process technologies.
Thanks to enhancements in the V-NAND’s atomic layer deposition process, manufacturing productivity has also increased by more than 30 percent. The cutting-edge technique allows the height of each cell layer to be reduced by 20 percent, prevents crosstalk between cells and increases the efficiency of the chip’s data processing.
“Samsung’s fifth-generation V-NAND products and solutions will deliver the most advanced NAND in the rapidly growing premium memory market,” said Kye Hyun Kyung, executive vice president of Flash Product and Technology at Samsung Electronics. “In addition to the leading-edge advances we are announcing today, we are preparing to introduce 1-terabit (Tb) and quad-level cell (QLC) offerings to our V-NAND lineup that will continue to drive momentum for next-generation NAND memory solutions throughout the global market.”
Samsung will be quickly ramping up production of its fifth-generation V-NAND to meet a wide range of market needs, as it continues to lead the high-density memory movement across critical sectors such as supercomputing, enterprise servers and the latest mobile applications such as premium smartphones.
Samsung Electronics, a world leader in advanced semiconductor technology, today announced that its strategic foundry collaboration with Arm will be expanded to 7/5-nanometer (nm) FinFET process technology to remain a step ahead in the era of high-performance computing.
Based on Samsung Foundry’s 7LPP (7nm Low Power Plus) and 5LPE (5nm Low Power Early) process technologies, the Arm® Artisan® physical IP platform will enable 3GHz+ computing performance for Arm’s Cortex®-A76 processor.
Samsung’s 7LPP process technology will be ready for its initial production in the second half of 2018. The first extreme ultra violet (EUV) lithography process technology, and its key IPs, are in development and expected to be completed by the first half of 2019. Samsung’s 5LPE technology will allow greater area scaling and ultra-low power benefits due to the latest innovations in 7LPP process technology.
The Arm Artisan physical IP platform for Samsung’s 7LPP and 5LPE includes HD logic architecture, a comprehensive suite of memory compilers, and 1.8V and 3.3V GPIO libraries. In addition, for Samsung’s 7LPP and 5LPE process technologies, Arm will provide Artisan POP IP solutions on its latest processor cores featuring Arm DynamIQ technology. Arm’s POP IP solution is a core-hardening acceleration technology to enable the best Arm processor implementations and the most rapid time-to-market.
“Building an extensive and differentiated design ecosystem is a must for our foundry customers,” said Ryan Sanghyun Lee, vice president of Foundry Marketing Team at Samsung Electronics. “Collaboration with Arm in the fields of IP solutions is crucial to increase high-performance computing power and accelerate the growth of Artificial Intelligence (AI) and Machine Learning capabilities.”
“Arm and Samsung Foundry have collaborated on a large number of chips using Artisan physical IP on Samsung Foundry process technologies,” said Kelvin Low, vice president of marketing, Physical Design Group at Arm. “Samsung Foundry’s 7LPP and 5LPE nodes are innovative process technologies which will meet our mutual customers’ needs to deliver the next generation of advanced system-on-chips (SoCs) from mobile to hyperscale datacenters.”
Details of the recent updates to Samsung’s Foundry roadmap, from 7nm EUV development to 3GAAE (3nm Gate-All-Around Early) technology, and top-notch design enablement solutions were presented at Samsung Foundry Forum 2018 Korea on July 5, 2018, in Seoul. Samsung Foundry Forums were held in the United States and China earlier this year, sharing Samsung’s cutting-edge process technologies with global customers and partners.
The 2018 Mobile World Congress Shanghai (MWCS) sees Samsung Electronics’ System LSI Business (“S.LSI”) showcase its innovative semiconductor technology which enhances device experience, with the image sensor, ISOCELL, and mobile AP, Exynos, ranges at its core.
MWCS is Asia’s leading tech industry event, taking place this year at the Shanghai New International Expo Center from June 27 – 29. This year over 100 countries are represented, with 550 companies attending. As the scale of MWCS is continually expanding, the event provides the perfect platform for Samsung to showcase its latest groundbreaking semiconductor technologies.
S.LSI has been participating in MWCS since last year, recognizing the growing importance of the Chinese presence in the global technology market. Highlighted at MWCS this year are S.LSI’s ISOCELL, Exynos, NFC and smart speaker ranges, with a variety of solutions – including the new ‘ISOCELL Plus’ – on show for customers from all around the world including China.
The ISOCELL series, first launched at MWCS 2017, is named after the patented Samsung ISOCELL technology which offers solutions for devices that require ultra-slim designs with high quality cameras.
Among the cutting-edge developments to the ISOCELL series presented at MWCS is the ISOCELL Slim 3P9 with Plug and Play solution for rear camera modules. The Plug and Play solution simplifies the camera module development and optimization process by providing a turnkey module, made up of an ISOCELL sensor and other primary elements from preferred partners, pre-tuned for VCX-standard image quality. Manufacturers can simply plug the module into a device, saving up to four months of development time.
The ISOCELL Plus, a new pixel isolation technology from Samsung, replaces the metal grid formed over the photodiodes with an innovative new material minimizing optical loss and light reflection. The ISOCELL Bright, harnessing Tetracell technology, merges four pixels into one so that users can achieve high quality images in all light conditions. The ISOCELL Fast utilizes Dual Pixel technology for faster, more accurate auto focus – even in low light conditions.
The Exynos series, the system-on-a-chip processors featured in Samsung’s own line of mobile devices, presents the latest in performance, efficiency and connectivity options.
The Exynos Series 7 9610 is a S.LSI’s high-end application processor that was introduced earlier this year, with enhanced image processing capabilities to support DSLR-like camera functions with AI-powered image processing. It is also the industry’s first SoC to offer 480fps filming for super slow-motion videos. Thanks to its patented vision-image processing DSP(digital signal processor), users can harness its object detection feature for various AI-powered applications, picture gallery classification and device security.
Also introduced this year, the Exynos 9810 is a premium processor, with Samsung’s 3rd-generation CPU core for enhanced AI and multimedia capabilities. The Exynos 7885 is a high-mid tier processor launched at the end of 2017, and the 7872 is the first to adopt a big CPU core in the volume-zone segment. Offering optimized performance and improved power efficiency, the Exynos processors provide for an incredible user experience.
NFC & Smart Speaker: The Latest in Contactless and Smart Home Technology
NFC Mobile POS and NFC Power Transfer exhibits the latest in contactless technology. With the Mobile POS, a mobile device can be used to replace a POS reader for virtual payments, and with the Power Transfer, a mobile phone can transfer power to mobile accessories utilizing NFC RF radiation.
The smart speaker is a great personal assistant for answering questions, playing your favorite music and controlling connected home devices. Based on various Samsung ICs, including Exynos AP, RF, PMIC, image sensor and secure element. Samsung’s smart speaker reference platform helps manufacturers reduced development time and a faster time-to-market.
Samsung Electronics, the world leader in advanced memory technology, today announced that it is being recognized for its environmental reliability by receiving the industry’s first Environmental Product Declaration* (EPD) certificate in Korea with its 512Gb 64-layer 3bit V-NAND and 860 EVO 4TB SSD.
The Environmental Product Declaration is a national certification system in Korea which recognizes a product’s performance according to seven key environmental metrics including carbon footprint, resource footprint, ozone depletion, acidification, eutrophication, photochemical smog, and water footprint.
In terms of per capacity (gigabit), the carbon emission of the 512Gb 3-bit V-NAND has been reduced to less than half of that of the 10-nanometer (nm)-class 64Gb V-NAND that was certified last year.
An 8TB SSD composed with the 512Gb V-NAND can reduce approximately 240kg CO2 of carbon emission per year compared to a 8TB SSD product composed with the 64Gb NAND, producing the same effect as planting twenty-five 30-year-old trees**.
“The EPD certification will serve as an assurance to our customers that Samsung’s high-capacity products offer not only cutting-edge technology, but also certified environmental reliability” said Mike Mang, Vice President of Brand Product Marketing, Memory Business at Samsung Electronics. “Samsung plans to begin mass production of 1Tb V-NAND in the future to lead the growth of the rapidly expanding ultrahigh-capacity storage market and strengthen its eco-friendly technology leadership.”
Samsung Electronics seeks to leverage its advancements in environmental reliability to lead the consumer market by exceeding customer expectations, just as it has continuously delivered in high performance and energy efficiency in the corporate SSD market.
Samsung earned its first low carbon footprint certification for the DDR3 DRAM server module in 2009 and had since expanded its environmental certification portfolio across its key products, including NAND flash, LPDDR, SSD, and application processors.
Samsung Electronics, a world leader in advanced semiconductor technology, today introduced its new ‘ISOCELL Plus’ technology, which allows CMOS image sensors to capture more light, significantly increasing light sensitivity and color fidelity. Smartphone consumers can now expect even more accurate and clearer photos in challenging light environments.
To take high-quality photographs, CMOS image sensors need to hold as much light, or photons, as possible and transmit the right color information to the photodiode. Such requirements were resolved by the introduction of Samsung’s ISOCELL technology in 2013. ISOCELL forms a physical barrier between the neighboring pixels, reducing color crosstalk and expanding the full-well capacity. This enables each pixel to absorb and hold more light than the conventional backside-illuminated (BSI) image sensor design for superior image quality.
With the introduction of ISOCELL Plus, Samsung pushes pixel isolation technology to a new level through an optimized pixel architecture. In the existing pixel structure, metal grids are formed over the photodiodes to reduce interference between the pixels, which can also lead to some optical loss as metals tend to reflect and/or absorb the incoming light. For ISOCELL Plus, Samsung replaced the metal barrier with an innovative new material developed by Fujifilm, minimizing optical loss and light reflection.
“We value our strategic relationship with Samsung and would like to congratulate on the completion of the ISOCELL Plus development,” said Naoto Yanagihara, corporate vice president of Fujifilm. “This development is a remarkable milestone for us as it marks the first commercialization of our new material. Through continuous cooperation with Samsung, we anticipate to bring more meaningful innovation to mobile cameras.”
The new ISOCELL Plus delivers higher color fidelity along with up to a 15-percent enhancement in light sensitivity. The technology also enables image sensors to equip 0.8-micrometer (µm) and smaller-sized pixels without any loss in performance, making it an optimal solution for developing super-resolution cameras with over 20 megapixels.
“Through close collaboration with Fujifilm, an industry leader in imaging and information technology, we have pushed the boundaries of CMOS image sensor technology even further,” said Ben K. Hur, vice president of System LSI marketing at Samsung Electronics. “The ISOCELL Plus will not only enable the development of ultra-high-resolution sensors with incredibly small pixel dimensions, but also bring performance advancements for sensors with larger pixel designs.”
The ISOCELL Plus will be showcased at the Mobile World Congress Shanghai, held from June 27 to 29.
With dramatic adventures and fantastical universes abound, entering the world of gaming is like traveling to a parallel dimension where anything is possible. There are more people than ever playing games, willing to spend valuable time and money on gaming to fulfill their need for virtual adventures.
But for the uninitiated, getting the right gaming setup can be daunting, especially when there are countless hardware combinations available. Fear not, help is on the way. Here’s a simple, step-by-step guide on all you need to know about gaming hardware.
From first-person shooters (FPSs), which place players squarely in the heart of battle, to massively multiplayer online role-playing games (MMORPGs), which immerse you in sprawling settings with millions of other gamers, there’s truly something for everyone in the gaming world.
Perhaps you’re interested in embarking on an epic quest in a role-playing game (RPG), or utilizing your analytical prowess to outsmart your opponents in a real-time strategy game. Or maybe you’d prefer to chase championship glory in a sports title, risk it all to be the last person standing in a battle royale, or invite your friends to play the virtual version of a classic board game.
All you need to do to get started is pick a title that interests you, install it on your computer, and you’re ready to begin your gaming adventure.
Here’s an all-too-common scenario: You’re eager to start your first mission, having familiarized yourself with the controls, but the game is taking too long to load.
If you’re playing on a desktop, an easy way to shorten load times is to upgrade to a solid-state drive (SSD). You may be able to do the same for your laptop, depending on its design.
Unlike hard disk drives (HDDs), SSDs do not feature moving mechanical parts, which means that they can load, store and read data three to four times faster. Samsung’s SSDs, the 860 EVO and 860 PRO, offer up to 530 MB/s and 560 MB/s read and write speeds, respectively. Featuring a five-year warranty, they’re reliable partners for all your gaming needs.
Installation is easy thanks to Samsung’s Data Migration program, which allows you to seamlessly transfer important data to your new computer drive. Simply connect the SSD to your computer via SATA USB cable, run the migration program, and your data will be automatically transferred to your new SSD.
Your upgraded SSD will allow you to enjoy an in-game edge. You’ll be able to load your game faster than other players, which will make it easier to, for instance, ready your forces for battle in an MMORPG.
If you’d like to enjoy your games anytime and anywhere, a gaming notebook (or laptop) could be just what you need. Gaming notebooks are high-performance PCs that support brilliant graphics and fast response speeds.
Samsung designed the Notebook Odyssey Z to take the gaming experience to new levels. The company’s latest gaming notebook comes equipped with an 8th generation Intel Core i7 hexacore processor, as well as the NVIDIA Pascal architecture-based GeForce GTX 1060 graphics card. The device also supports the latest DDR4 memory with a bandwidth of 2,400 MHz, which allows games to operate at lightning quick speeds.
These components allow the Notebook Odyssey Z to foster an ideal gaming experience. And if that’s not enough, the notebook also features convenient shortcut keys – to initiate screen captures, activate silent mode, and more – along with a Beast Mode function, which instantly boosts performance by 17 percent.
To help ensure that games run as smoothly as possible, the notebook features Samsung’s innovative Z AeroFlow Cooling System, which consists of three lightweight components: the Dynamic Spread Vapor Chamber, the Z AeroFlow Cooling Design, and dual Z Blade Blowers. Together, this powerful trio of technologies ensures that the notebook remains cool and powerful even when handling the most demanding of games. By directing cold air to the warmest parts of the device and expelling warm air through the vents, the system creates a pleasant, heat-free environment that’s perfect for extended gaming sessions.
Practice makes perfect. But at a certain point, you’ll find that your gaming skills are improving at a slower pace. That’s when having gaming-specific accessories can help take your experience to the next level.
By simply adding a gaming mouse and keyboard to your setup, you’ll notice an immediate difference in your reaction speed and accuracy.
When shopping for a gaming mouse, pay attention to the dots-per-inch (DPI) number. The higher the figure, the more sensitive the mouse is. Trying different mouse and keyboard combinations is also essential to finding a pair that clicks with you.
With sound design becoming increasingly sophisticated, it’s important for players to hear even minor audio details during gameplay. Extra layers of sound from additional speakers will improve your sense of anticipation and allow you to prepare for attacks from all directions.
Being able to quickly spot hidden items and accurately distinguish different characters are crucial skills in the gaming world. However, details needed for identification may not show up clearly on a laptop with a small screen.
Samsung’s latest high-resolution gaming monitor, the super ultra-wide (32:9) CHG90, can alleviate this frustration. The 49-inch monitor’s 144Hz refresh rate allows it to deliver smooth and captivating visuals, even for games with high-spec graphics. The device also boasts a 1800R curvature, and features Quantum dot and HDR technology to foster lifelike, vibrant images that make gamers feel like they’re in the heart of the action.
To further amplify gamers’ immersion, the CHG90 offers an 1ms (MPRT) response time, which minimizes the effects of motion blur, as well as an innovative Black Equalizer feature, which enhances visibility in dark areas of the screen to make it easier for gamers to spot items and lurking enemies.
Not so long ago, accessing the world of virtual reality required traveling to one of the few locations that possessed the requisite technology. Today, however, the excitement of mixed reality (MR) can be enjoyed from the comfort of your home.
Equipped with dual 3.5-inch AMOLED displays, the HMD Odyssey utilizes mixed reality to bring an unparalleled level of immersion to video games. The headset’s 1,600 x 1,440 resolution and 130-nit brightness ensure that even a game’s finest details are crystal clear. Its built-in AKG headphones, meanwhile, support 360° spatial sound, transforming games into multi-sensory experiences.
By replacing the keyboard and mouse with ergonomic motion controllers, the headset offers gamers limitless freedom to traverse virtual terrains. The motion sensors are built into the headset, which makes installing the HMD Odyssey as easy as plugging a memory stick into your computer.
Support for the wide range of VR-enabled apps and games available in the Microsoft Store, as well as the over 4,000* titles in the Steam VR catalog, makes the HMD Odyssey the ultimate platform for modern-day gaming.
Congratulations, you have successfully completed all the levels in this guide! It’s time to start your first virtual adventure, where things will get a little trickier.
Samsung Electronics, the world leader in advanced memory technology, today announced that it has launched the industry’s highest capacity NVMe solid state drive (SSD) based on the incredibly small Next-generation Small Form Factor (NGSFF)* – an eight-terabyte (TB) NF1** SSD. The new 8TB NVMe NF1 SSD has been optimized for data-intensive analytics and virtualization applications in next-generation data centers and enterprise server systems.
“By introducing the first NF1 NVMe SSD, Samsung is taking the investment efficiency in data centers to new heights,” said Sewon Chun, senior vice president of Memory Marketing at Samsung Electronics. “We will continue to lead the trend toward enabling ultra-high density data centers and enterprise systems by delivering storage solutions with unparalleled performance and density levels.”
The new SSD is built with 16 of Samsung’s 512-gigabyte (GB) NAND packages, each stacked in 16 layers of 256 gigabit (Gb) 3-bit V-NAND chips, achieving an 8TB density in an ultra-small footprint of 11cm x 3.05cm. This is twice the capacity offered by the M.2 NVMe SSD (11cm x 2.2cm) commonly used in hyper-scale server designs and ultra-slim laptops. The NF1 SSD is expected to quickly and easily replace conventional 2.5-inch NVMe SSDs by enabling up to three times the system density in existing server infrastructure, allowing for an unprecedented 576TB of storage space in the latest 2U rack servers.
The NF1 SSD features a brand new, high-performance controller that supports the NVMe 1.3 protocol and PCIe 4.0 interface, delivering sequential read speeds of 3,100 megabytes per second (MB/s) and write speeds of 2,000MB/s. These speeds are more than five times and three times that of a typical SATA SSD, respectively. Random speeds come in at 500,000 IOPS for read operations and 50,000 IOPS for writes. Utilizing the new NF1 storage solution, an enterprise server system can perform over one million IOPS in a 2U rack space, significantly enhancing the return on investment for next-generation large-scale data centers. The SSD also includes a 12GB LPDDR4 DRAM to enable faster and more energy-efficient data processing.
To ensure long-term data reliability, the NF1 NVMe SSD has been designed with an endurance level of 1.3 drive write per day (DWPD), which guarantees writing an entire 8TB of data 1.3 times a day over its three-year warranty period.
Samsung plans to accompany its 256Gb 3-bit V-NAND-based SSD with a 512Gb version in the second half of this year to accommodate even faster processing for big data applications, while also accelerating the growth in next-generation enterprise and mid-market data centers.
* Next-generation Small Form Factor (NGSFF) is the latest SSD standard which is expected to be standardized by JEDEC in October. It succeeds the M.2 standard and can more than double the space utilization within server systems.
Spring has sprung, with summer fast approaching, and just like countless others across the Northern Hemisphere, the employees at Samsung Electronics’ semiconductor manufacturing sites have spent the last several weeks enjoying the terrific weather that comes with the season.
To help make this spring extra special, the centers, known for their strict protocols and security, organized their first official photo contest. Held from April 6 to May 3, the contest offered employees across four Samsung semiconductor campuses a chance to soak in the sun, admire blooming cherry blossoms, and share snapshots of the beauty that surrounds them every day.
Take a look at some of the contest’s standout submissions below.
Budding flowers are a sure sign that spring has finally come. Viewers of this vibrant image of canola flowers and pinwheels may be surprised to learn that it was snapped not on Korea’s picturesque Jeju Island, but at Samsung’s Onyang Campus.
Dae-young Kim’s photograph, captured while strolling around the Hwaseong Campus at lunchtime, depicts rows of beautiful tulips lining a tranquil stream in front of the campus’s cafeteria.
For Sang-hun Kim, the contest offered an excellent opportunity to enjoy the spring weather with colleagues. One day, when crossing the cherry blossom tree-lined road that leads to the Onyang Campus’s dormitory, Kim was reminded of the iconic cover of the Beatles’ “Abbey Road” album.
Inspired, Kim returned to the crosswalk with his colleagues to snap a fun, Abbey Road-esque photo. His usual route to work had instantly transformed into a scenic setting for an unforgettable shot.
Elsewhere on the Onyang Campus, colleagues pose for a playful photo amongst pinwheels spinning in the warm spring breeze.
Employees at the Onyang Campus are all smiles as they pause for a photo beneath blooming cherry blossoms. As you can see from their beaming smiles, the team is enjoying the relaxing time together.
Each spring, the Giheung and Hwaseong Campuses organize their annual employee fun run, the Spring Race for Love. Proceeds from the race go toward efforts to enrich the campuses’ respective communities. A Giheung Campus employee Youngjong Yoon captured this candid shot of race participants using his camera.
For Il-jin Shin, the all-glass exterior of the Onyang Campus’s R&D Center proved the perfect canvas for capturing the beauty of a bright spring sky.
Here we have another submission from Il-jin Shin, taken in front of the Onyang Campus’s TP Center. The bright pastel colors adorning Buildings 1, 2 and 3 reminded Shin of spring flowers in bloom.
The photo contest showcased the unique and creative perspectives of Samsung employees.
Light trails created by car and bus headlights symbolize the dynamic nature of Samsung’s semiconductor business. It took Hyeon-gang Heo quite a bit of time to find the perfect moment to take the photo. However, as he notes, the end result was well worth the wait.
Lastly, we have the contest’s grand prize-winning entry, captured by Dong-jin Lim at the Hwaseong Campus. The image depicts two employees as they head back to work at the Line 17 building – the campus’s latest production facility.
The summer heat may be on its way, but the talented individuals at Samsung’s semiconductor manufacturing sites will continue to greet each day with the zeal of spring, and do their part to help usher in a brighter future.
Samsung Electronics, the world leader in advanced memory technology, today announced that it has started mass producing the industry’s first 32-gigabyte (GB) double data rate 4 (DDR4) memory for gaming laptops in the widely used format of small outline dual in-line memory modules (SoDIMMs). The new SoDIMMs are based on 10-nanometer (nm)-class process technology that will allow users to enjoy enriched PC-grade computer games on the go, with significantly more capacity, higher speeds, and lower energy consumption.
Using the new memory solution, PC manufacturers can build faster top-of-the-line gaming-oriented laptops with longer battery life at capacities exceeding conventional mobile workstations, while maintaining existing PC configurations.
“Samsung’s 32GB DDR4 DRAM modules will deliver gaming experiences on laptops more powerful and immersive than ever before,” said Sewon Chun, senior vice president of memory marketing at Samsung Electronics. “We will continue to provide the most advanced DRAM portfolios with enhanced speed and capacity for all key market segments including premium laptops and desktops.”
Compared to Samsung’s 16GB SoDIMM based on 20nm-class 8-gigabit (Gb) DDR4, which was introduced in 2014, the new 32GB module doubles the capacity while being 11 percent faster and approximately 39 percent more energy efficient.
With a total of 16 of Samsung’s newest 16-gigabit (Gb) DDR4 DRAM chips (eight chips each mounted on the front and back), the 32GB SoDIMM allows gaming laptops to reach speeds up to 2,666 megabits-per-second (Mbps).
A 64GB laptop configured with two 32GB DDR4 modules consumes less than 4.6 watts (W) in active mode and less than 1.4W when idle. This reduces power usage by approximately 39 percent and over 25 percent, respectively, compared to today’s leading gaming-oriented laptops, which are equipped with 16GB modules.
Samsung has begun to aggressively expand its offering of the industry’s largest 10nm-class DRAM lineup (16Gb LPDDR4, 16Gb GDDR5, and 16Gb DDR4), which will usher in a new era of 16Gb DRAM in the mobile, graphics, PC and server segments, and subsequently in other markets such as supercomputers and automotive systems.
*Editor’s Note: 10nm-class is a process node between 10 and 19 nanometers
Just like any other electronic device, memory cards have a life cycle – one that, unfortunately, can end at the most inopportune of times. Devices that are constantly recording footage, such as surveillance cameras, require a memory card that’s capable of handling the heaviest of workloads. Just imagine if, for instance, the memory card in your car’s dashcam stopped recording when you needed it most.
Constant use, however, can deteriorate a memory card’s life expectancy by as much as three months. Under certain circumstances, the recordings of always-on devices like dashcams and surveillance cameras can be absolutely crucial. Therefore, it’s important that we regularly check these devices’ memory cards’ health and replace them when necessary to prevent potential errors and data loss.
Samsung’s new PRO Endurance memory cards have been specially designed to stand up to these devices’ rigorous workloads, delivering up to five years (43,800 hours)1 of full HD video. Each memory card benefits from advanced Samsung technologies, including the 64-layer, 256GB MLC V-NAND, as well as an exclusive controller and firmware, to offer the industry’s highest level of endurance. This allows users to record hours-long full HD and 4K video – at sequential read and write speeds of 100MB/s and 30MB/s, respectively – without fear of data loss.
Each memory card is built to withstand the types of environments that always-on recording devices are typically exposed to, which means they’re not only waterproof but designed to operate without fail in temperatures ranging anywhere from minus-25 to 80 degrees Celsius. They’re also built to protect data from the effects of X-rays and magnetic fields.2
Check out the video below to learn more about how the newest additions to Samsung’s memory card lineup safeguard important data.
1 64GB models offer up to 26,280 hours (3 years); 32GB models offer up to 17,520 hours (2 years)
2 Waterproof: IEC 60529, IPX7; Temperature: from -25ºC to 85ºC (-13°F to 185°F) operating; Magnetic: up to 15,000 gauss (equal to MRI); X-rays: up to 50 Roentgen (equal to airport X-ray machines)
Samsung Electronics, a world leader in advanced digital component solutions, today announced that it is now offering LED component solutions that have been optimized for horticulture lighting. The company’s new horticulture LED lineup features a newly developed “red LED” package, as well as additions to key existing Samsung “white LED” package and module families to include horticulture lighting specifications.
“Our horticulture LED solutions are based on LED technologies that deliver proven levels of performance and reliability across an extensive range of lighting applications,” said Yoonjoon Choi, vice president of LED Business Team at Samsung Electronics. “By broadening our lineup to include horticulture LEDs, we are providing global luminaire manufacturers with a one-stop resource for these solutions as well as for our many other LED technologies.”
Samsung’s new horticultural LED – the LH351B Red – is a high-power package providing a wavelength of 660 nanometers (nm) with a photosynthetic photon flux (PPF)* value of 2.15 micromoles per second (μmol/s) (350mA), making it optimal for most types of horticulture lighting. The 660-nm wavelength helps to accelerate the growing of plants including their photosynthesis, as well as enrich the blooming of flowers. The package also features a very low thermal resistance of 2.0 kelvins per watt (K/W), allowing for easier heat dissipation within LED luminaires. Moreover, the LH351B Red uses the same electrode pad design as its LH351 series counterparts, enabling greater PCB design flexibility in luminaire manufacturing.
Beyond its new LH351B Red offering, Samsung has added horticulture specifications to its mid-power packages – LM301B; LM561C, and two linear modules – Q-series and H inFlux. These LED component families now include PPF values of 0.52μmol/s (65mA), 0.49μmol/s (65mA), 24μmol/s (0.45A, 21.9V) and 114μmol/s (1.38A, 46.9V), respectively.
In addition, the white LED packages and modules feature extremely high light efficacy of 2.92 micromoles per joule (μmol/J) (65mA), 2.72μmol/J (65mA), 2.43μmol/J (0.45A, 21.9V) and 1.76μmol/J (1.38A, 46.9V), respectively, while the LH351B Red delivers 3.13μmol/J (350mA). These high efficacy levels minimize the impact of lighting on ambient temperatures, allowing growers to better control temperatures in almost any greenhouse environment and save on energy costs.
Samples of Samsung’s horticulture LEDs are available now and will be showcased at LIGHTFAIR International 2018 (booth #1112) in Chicago, Illinois (USA), May 8-10.
* Editor’s Note: PPF (photosynthetic photon flux) is a unit that measures the total amount of photons in the photosynthetically active radiation (PAR) range – a spectral range between 400 and 700nm that supports plant photosynthesis.
Samsung Electronics, a world leader in advanced semiconductor technology, today introduced a new 16-megapixel (Mp) ISOCELL Slim 3P9 image sensor along with a Plug and Play solution, a pre-optimized turnkey camera module made up of an ISOCELL image sensor and preferred partner components to help expedite time-to-market.
“Samsung’s ISOCELL image sensors take advantage of various technologies to deliver innovative imaging experiences in mobile devices,” said Ben K. Hur, vice president of System LSI marketing at Samsung Electronics. “The ISOCELL Plug and Play solution will help reduce time-to-market for set makers and offer a quality-assured camera solution to end-users.”
The Samsung ISOCELL Slim 3P9 is a 1.0μm 16Mp image sensor with Tetracell technology that allows bright and vivid pictures in today’s sleekly designed smartphones. With Tetracell, a technology that merges four neighboring pixels, the 3P9 can function as a 2.0μm image sensor for front-facing cameras that can take brighter pictures in low-lit environments.
For faster auto-focusing, the 3P9 adopted an advanced phase detection auto-focus (PDAF) with doubled auto-focus agent density than that of conventional PDAF sensors. In addition, the sensor significantly stabilizes pictures and videos taken while in motion with a gyro-synchronizer that syncs frame exposure time from the sensor with movement data from the device’s gyroscope. Once the data is synced, the mobile processor can simply adjust the frames based on movement rather than rigorously analyzing each frame to detect and compensate for angular movement.
For easier camera optimization while accelerating time-to-market, Samsung also offers an ISOCELL Plug and Play solution for the 3P9 in a rear camera module. Optimizing a camera module, made up of parts from different providers, with the mobile processor can be an arduous and lengthy task for smartphone makers. Samsung’s ISOCELL Plug and Play solution simplifies this process by offering a turnkey ISOCELL sensor module tuned for Valued Camera eXperience (VCX)-grade image quality, along with other components, including lenses and actuators from preferred partners.
Since the optimization and reliability tests are done beforehand at the module-level rather than on the sensor alone, manufacturers can simply plug the camera module onto their device, saving up to four months of development time.
The Samsung ISOCELL Slim 3P9 with Plug and Play solution is currently available.
Samsung Electronics introduced today the Samsung PRO Endurance microSDHC/microSDXC card, which offers industry-leading endurance and up to 43,8001 hours of continuous video recording2. Designed for consumers and B2B channel customers who use intensive video monitoring applications such as surveillance and security cameras, body cameras and dash cams, the PRO Endurance makes continuous video monitoring fast and stable. It delivers read speeds of up to 100 MB/s and provides FHD recording and 4K support via write speeds of up to 30 MB/s3.
“Consumers want to feel assured with their video surveillance solutions, and the need for longer-lasting, higher performing memory cards that can withstand extreme conditions and capture critical moments is at an all-time high,” said Un-Soo Kim, senior vice president of Brand Product Marketing, Memory Business at Samsung Electronics. “Samsung is proud to again advance what is possible in memory card technology with the introduction of the PRO Endurance, which offers security-minded consumers the industry’s highest levels of endurance and optimized read/write speeds for immediate access to critical surveillance content.”
The Samsung PRO Endurance offers 25 times higher endurance4 than previous speed-focused cards5. It also comes with an industry-leading limited warranty up to five years6, and sets a new standard for capacity with its 128GB7 of storage.
The Samsung PRO Endurance is built to withstand harsh environments and features Samsung’s 4-Proof8 protection, making it water, temperature, magnetic and x-ray-proof. In times of emergencies, accidents or crisis, the PRO Endurance is the reliable solution to capture the crucial moments without the risk of compromised or lost data.
The PRO Endurance memory cards are now available for purchase with manufacturer’s suggested retail prices starting at $89.99 for 128GB, $44.99 for 64GB and $24.99 for 32GB. For more information, please visit www.samsung.com/memorycard.
Key Specifications for PRO Endurance
Samsung PRO Endurance
microSDHC and microSDXC
Sequential read speeds up to 100MB/s,
Sequential write speeds up to 30MB/s
Bus Speed Mode
Waterproof (IEC 60529, IPX7), Temperature proof, X-ray proof, Magnetic proof
Other than the smartphone and tablet, which device is also mobile and electronic? Cars are comprised of many important mechanical parts, many of which have been at their core for years now. But cars also can be considered as highly sophisticated electronic systems, hence semiconductors constituting an essential section.
As the graphics show below, semiconductor solutions are used in a wide array of automotive applications such as the camera and sensing system, dashboard, IVI (In-Vehicle Infotainment) system, ADAS (Advanced Driver Assistant System), autonomous driving central computing system and gateway. Semiconductors will be used even more extensively in the future, especially with the potential introduction of autonomous driving.
Samsung has been continuously cooperating with leading automobile manufacturers to make its semiconductor technologies available in the industry’s latest automobiles as well as next-generation cars. The company has participated in the Audi Progressive SemiConductor Program (PSCP) since 2015 with its advanced memory solutions and Exynos processors.
With its multiple operating system compatibility and support for multi-display, Samsung’s flagship Exynos processors enable powerful computing and graphics processing performance for today’s automobiles with highly graphical user interfaces. Along with its Exynos offerings, Samsung also plans to develop a wide array of logic IC solutions for upcoming automotive applications. Images sensors, working as the eyes of future vehicles, will have further improved frame rate and light sensitivity for thorough monitoring and sensing the driving environment.
When it comes to memory solutions, Samsung provides its high-performance, high-density LPDDR4 /LPDDR4X and GDDR6 DRAM lineups to address ever increasing demand for higher data bandwidth. For secure data storage, Samsung offers advanced eMMC and UFS solutions. All of these Samsung semiconductor solutions for automotive applications guarantee the highest performance levels among their kinds and are designed to endure tough environments inside the automobiles such as sudden temperature changes and continuous vibration.
Also offered by Samsung are LED components for interior and exterior lighting of automobiles such as cluster indicator lighting, headlamps and turn signal lamps. Based on upcoming technologies like pixel lighting, Samsung will be able to provide LED packages and modules that will enable more sophisticated and reliable lighting solutions.
Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing 10-nanometer (nm)-class* 16-gigabit (Gb) LPDDR4X DRAM for automobiles. The latest LPDDR4X features high performance and energy efficiency while significantly raising the thermal endurance level for automotive applications that often need to operate in extreme environments. The 10nm-class DRAM will also enable the industry’s fastest automotive DRAM-based LPDDR4X interface with the highest density.
“The 16Gb LPDDR4X DRAM is our most advanced automotive solution yet, offering global automakers outstanding reliability, endurance, speed, capacity and energy efficiency, ,” said Sewon Chun, senior vice president of memory marketing at Samsung Electronics. “Samsung will continue to closely collaborate with manufacturers developing diverse automotive systems, in delivering premium memory solutions anywhere.”
Moving a step beyond its 20nm-class ‘Automotive Grade 2’ DRAM, which can withstand temperatures from -40°C to 105°C, Samsung’s 16Gb LPDDR4X is Automotive Grade 1-compliant, raising the high-end threshold to 125°C. By more than satisfying the rigorous on-system thermal cycling tests of global auto manufacturers, the 16Gb LPDDR4X has enhanced its reliability for a wide variety of automotive applications in many of the world’s most challenging environments.
Adding to the degree of reliability under high temperatures, production at an advanced 10nm-class node is key to enabling the 16Gb LPDDR4X to deliver its leading-edge performance and power efficiency. Even in environments with extremely high temperatures of up to 125°C, its data processing speed comes in at 4,266 megabits per second (Mbps), a 14 percent increase from the 8Gb LPDDR4 DRAM that is based on 20nm process technology, and the new memory also registers a 30 percent increase in power efficiency.
Along with a 256 gigabyte (GB) embedded Universal Flash Storage (eUFS) drive announced in February, Samsung has expanded its advanced memory solution lineup for future automotive applications with the 10nm-class 16Gb LPDDR4X DRAM, commercially available in 12Gb, 16Gb, 24Gb and 32Gb capacities. While extending its 10nm-class DRAM offerings, the company also plans on bolstering technology partnerships for automotive solutions that include vision ADAS (Advanced Driver Assistance Systems), autonomous driving, infotainment systems and gateways.
*Editor’s Note: 10nm-class is a process node between 10 and 19 nanometers
Samsung Electronics, today introduced the Samsung 970 PRO and EVO, the third generation of its industry-leading consumer solid state drive (SSD) lineup. Having led the market with the first consumer-focused NVMe SSD in 2015, Samsung continues to push the performance barriers with this latest generation of SSDs that are built for tech enthusiasts and professionals so that they can enjoy higher bandwidth for intensive workloads on PCs and workstations.
“Samsung has led the NVMe SSD industry since its inception, and the company continues to define the latest standards of consumer storage with unprecedented performance of the 970 PRO and EVO SSDs,” said Un-Soo Kim, senior vice president of Brand Product Marketing, Memory Business at Samsung Electronics. “The 970 series sets a new bar in all aspects for the NVMe SSD market with groundbreaking performance, superior reliability and best-in-class capacity.”
The Samsung 970 PRO and EVO are designed based on the M.2 form factor standard and with the latest PCIe Gen 3×4 lane interface. The 970 series maximizes the potential of NVMe bandwidth, delivering unparalleled performance for processing large volumes of data, including 3D, 4K graphics work, high-end games and data analytics.
The 970 PRO enables sequential read speed of up to 3,500 MB/s and sequential write speed of up to 2,700 MB/s1, while the EVO features sequential read speed of up to 3,500 MB/s and sequential write speed of up to 2,500 MB/s2. The sequential write speeds represent an enhancement of up to 30 percent over the previous generation3, thanks to Samsung’s latest V-NAND technology and the newly designed Phoenix controller. The 970 EVO, in particular, utilizes the Intelligent TurboWrite technology, which uses a large buffer size of up to 78GB4 to enable faster write speeds.
In addition to the advancements in performance levels, the 970 PRO and EVO deliver exceptional endurance and reliability. Featuring a five-year warranty5, or up to 1,200 terabytes written6 – 50 percent higher than those provided for the previous generation7 – the 970 PRO and EVO are built to last. The Dynamic Thermal Guard technology safeguards against overheating by automatically monitoring and maintaining optimal operating temperatures, while a heat spreader and new nickel-coated controller further lower the SSD temperatures.
The 970 PRO and EVO also provide greater system design flexibility for the high-performance computing systems. Offering a variety of high capacity options in a compact M.2 form factor – including the single-sided 2TB EVO model – the 970 series enables convenient storage expansion across a wide range of computing devices.
The 970 EVO will be offered in 250GB, 500GB, 1TB and 2TB8 capacities, and the 970 PRO in 512GB and 1TB capacities. The 970 PRO and EVO will be available for purchase worldwide starting May 7, 2018, with manufacturer’s suggested retail prices starting at $329.99 and $119.99 USD, respectively. For more information, including warranty details, please visit www.samsung.com/SSD, www.samsungssd.com.
PCIe Gen 3.0 x4, NVMe 1.3
Samsung 64L V-NAND 2-bit MLC
Samsung 64L V-NAND 3-bit MLC
Samsung Phoenix Controller
1GB LPDDR DRAM (1TB)
512MB LPDDR4 DRAM (512GB)
2GB LPDDR4 DRAM (2TB)
1GB LPDDR4 DRAM (1TB)
512MB LPDDR4 DRAM (250GB/500GB)
512GB and 1TB
250GB, 500GB, 1TB and 2TB
Sequential Read/Write Speed
Up to 3,500/2,700 MB/s
Up to 3,500/2,500 MB/s
Random Read/Write Speed
Up to 500,000/500,000 IOPS
Up to 500,000/480,000 IOPS
Samsung Magician Software
Class 0 (AES 256), TCG/Opal v2.0, MS eDrive (IEEE1667)
1 970 PRO and EVO performance may vary based on SSD’s firmware version, system hardware and configuration. Performance measurements based on IOmeter 1.1.0. *Test system configuration: Intel Core i7-7700K CPU @4.2GHz, DDR4 2400MHz 32GB, OS-Windows 10 Built 10240, Chipset–ASUS PRIME Z270-A.
2 Performance may vary based on SSD’s firmware version, system hardware and configuration. Performance measurements based on IOmeter 1.1.0.
Write performance measurements are based on Intelligent TurboWrite technology.
The sequential write performances after TurboWrite region are: 300 MB/s(250GB), 600 MB/s(500GB), 1,200 MB/s(1TB) and 1,250 MB/s(2TB).
The random write performances after TurboWrite region are: 80,000 IOPS(250GB), 160,000 IOPS(500GB) and 300,000 IOPS(1TB/2TB).
* Test system configuration: Intel Core i7-7700K CPU @4.2GHz, DDR4 2400MHz 32GB, OS-Windows 10 Built 10240, Chipset–ASUS PRIME Z270-A.
3 Up to 29% and 32% in sequential write speeds, respectively, have increased when compared to Samsung 960 PRO and EVO.
4 970 EVO Intelligent TurboWrite buffer size varies based on the capacity of the SSD: 13GB for 250GB model, 22GB for 500GB model, 42GB for 1TB model and 78GB for 2TB model. For more information on the TurboWrite, please visit www.samsungssd.com.
5 Five years or TBW, whichever comes first. For more information on the warranty, please find the enclosed warranty document in the package.
6 Warrantied TBW(Total byte written) for 970 PRO: 600TB for 512GB model, 1,200TB for 1TB model; Warrantied TBW(Total byte written) for 970 EVO: 150TB for 250GB model, 300TB for 500GB model, 600TB for 1TB model, 1,200TB for 2TB.
7 50% increase when compared to Samsung 960 PRO and EVO.
8 1GB=1,000,000,000 bytes by IDEMA. A certain portion of capacity may be used for system file and maintenance use, so the actual capacity may differ from what is indicated on the product label.
In a scene not dissimilar to a sci-fi movie, a desolate planet is immediately transformed into a vibrant city thanks to the latest innovation from Samsung. In the launch video, the drive activates a new high technology world in outer space, symbolizing how the Samsung NVMe solid state drives (SSD) 970 can power the users’ imagination. Samsung’s leading SSD series allows users to boost their creativity and enhance daily workflow with its unprecedented performance.
The speed of the Samsung 970 PRO and EVO SSD that unlocks a new level of computing performance is unveiled in the video. The new line of SSDs can completely transform how tech enthusiasts and professionals think about computing, forming a vital piece of the puzzle to making the best of high-performance computing system.
For high performance PC users looking to process large volumes of data for 3D and 4K graphics work, high end games, or data analytics, the 970 series sets a new standard. The new SSDs have improved write speeds that are up to 30 percent in sequential write speeds, 50 percent in random write speeds better than the previous generation, thanks to Samsung’s latest V-NAND technology and the newly designed Phoenix controller. The NVMe interface allows for industry-leading performance and sequential read/write speeds up to 3500MB/s, 2700MB/s . With the new 970 PRO and EVO, Samsung has once again set a precedent for consumer-focused NVMe SSDs – a market the company has led since its inception in 2015.
Check out how the 970 PRO and EVO make all the difference in this video below.
This NVMe SSD 970 video is a continuation of the previous generation’s launch video, which portrayed the SSD 960 pioneering new possibilities in outer space. Check out the Samsung NVMe SSD 960 video here.
High performance, faster speeds and better reliability are the headline features of the new NVMe SSD 970 PRO and EVO, which boasts up to six times faster speed than the existing SATA SSD. On May 7, the new Samsung SSD 970 PRO and EVO will be launched in 50 countries, including the United States and China.
The 970 series maximizes the potential of NVMe bandwidth. The 970 PRO enables sequential read speed of up to 3,500 MB/s and sequential write speed of up to 2,700 MB/s, which means it can read a five-gigabyte (GB) movie in a mere second and write in 1.9 seconds.
Check out the infographic on NVMe SSD 970, which provides exactly what power-users are looking for in an SSD.
Hidden under the cover of today’s advanced mobile devices, there are innovative semiconductor and LED solutions built in to enable new features and technologies consumers are continuously seeking.
With its decades-long technology innovation and expertise, Samsung Electronics’ Device Solutions Division provides an extensive range of semiconductor and LED solutions to meet the ever-increasing requirements of the mobile industry. While not always visible to end users, Samsung’s component solutions have been utilized comprehensively to raise the level of what’s possible for mobile devices, and help enable a world of difference in performance and user experience.
Here, we go under the hood, to take a look at some of these solutions.
Leading-edge Processor and Memory Solutions for a Seamless User Experience
One prime example of Samsung’s component innovation is the Exynos 9 Series 9810 processor, built upon the company’s latest 2nd generation 10-nanometer LPP process technology. The processor delivers powerful mobile computing performance with its 3rd generation CPU and seamless connectivity with a 6-mode/all network supporting 1.2Gbps DL 6CA Cat.18 LTE modem.
Working in tandem with the Exynos processor is the LPDDR4X memory chip, the industry’s most up-to-date mobile DRAM solution that provides breakthrough RAM performance and energy efficiency. Available in a compact package offering up to 8-gigabyte (GB) capacity, the LPDDR4X enables prompt multitasking and data processing for advanced mobile applications such as 4K UHD video recording and virtual computing.
Also, under today’s heavy multimedia and content use environment, users can safely store their valuable data on Samsung eUFS, an embedded high-speed mobile storage solution for flagship devices. Based on Samsung’s proprietary V-NAND technology, the eUFS features ultrafast data read and download speeds as well as abundant storage capacity as high as 512GB.
Enhanced Imaging and Video Features
The Samsung ISOCELL Fast 2L3, a 3-stack fast readout image sensor with an embedded 2Gb LPDDR4 memory, enables significantly enhanced mobile imaging and video functionality with the ability to record at 960fps for brand new features like stunning slow-motion video shooting. Also among Samsung’s broad image sensor lineup is a front-facing ISOCELL Bright image sensor, which enables high-quality selfies on mobile devices even in very low light settings, using leading-edge pixel technologies.
In addition, Samsung’s Patterned Lens-Integrated Flash LED component, positioned next to the rear camera, enhances the quality of images even further with its high luminous intensity and uniformity.
Reinforced Security, Power and Touch Command Management
Samsung continues to reinforce security, power, and touch command management on mobile devices through an array of component solutions. For example, its new iris sensor enables a fast yet highly secure option to unlock or authorize application access, and the touch controller enables instant feedback at the tap of one’s finger. Last but not the least, Samsung’s power management IC delivers a stable supply of power, supporting devices to perform with optimal energy efficiency.
As mobile devices continue to evolve, Samsung Electronics’ Device Solutions Division will remain committed to developing and providing its customers with semiconductor and LED technology with distinct value, and providing the best in performance, capacity, functionality and energy efficiency.
Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production of a 256-gigabyte (GB) embedded Universal Flash Storage (eUFS) solution with advanced features based on automotive specifications from the JEDEC UFS 3.0 standard, for the first time in the industry.
Following the memory breakthrough of the automotive industry’s first 128GB eUFS in September, 2017, Samsung’s 256GB eUFS is now being shipped to automotive manufacturers preparing the market for Advanced Driver Assistance Systems (ADAS), next-generation infotainment systems and new-age dashboards in luxury vehicles.
As thermal management is crucial for automotive memory applications, Samsung’s 256GB eUFS extends the temperature range to between -40°C and 105°C for both operational and power-saving modes. Warranties for conventional embedded multimedia card (eMMC) 5.1 solutions generally cover -25°C to 85°C for vehicles in operation and -40°C to 85°C when in idle or power-saving mode,
“With the new temperature threshold for automobile warranties, major automotive manufacturers can now design-in memory that’s even well suited for extreme environments and know they will be getting highly reliable performance,” said Kyoung Hwan Han, vice president of NAND marketing at Samsung Electronics. “Starting with high-end vehicles, we expect to expand our business portfolio across the entire automotive market, while accelerating growth in the premium memory segment.”
Samsung’s 256GB eUFS not only can easily endure the new temperature specification, despite the heat-sensitive nature of memory storage, but also through its temperature notification feature, a sensor will notify the host application processor (AP) when the device temperature exceeds 105°C or any pre-set level. The AP would then regulate its clock speed to lower the temperature to an acceptable level.
Sequential reads for the 256GB eUFS can reach 850 megabytes per second (MB/s), which is at the high end of the current JEDEC UFS 2.1 standard, and random read operations come in at 45,000 IOPS. In addition, a data refresh feature speeds up processing and enables greater system reliability by relocating older data to other less-used cells.
The temperature notification, developed by Samsung, and data refresh features are included in UFS specification, version 3.0, which was announced last month by JEDEC, a global semiconductor standards organization.
Samsung plans to bolster its technology partnerships with global automakers and component providers, and continue expanding its eUFS line-up with an aim to lead the premium memory market.
Samsung Electronics, a world leader in advanced semiconductor technology, today introduced a total dual camera solution with ISOCELL Dual image sensors and proprietary software for two popular features – refocusing (bokeh) and low-light shooting (LLS). While such dual camera features had generally been exclusive to premium smartphones, Samsung’s ISOCELL Dual sensors and its library of proprietary software algorithms enable these features in lower price mobile devices.
“Dual cameras are delivering new and exciting photo-taking experiences on mobile devices,” said Ben K. Hur, vice president of System LSI marketing at Samsung Electronics. “Samsung’s total solution for ISOCELL Dual will make our customers’ product development process easier, allowing them to bring the most optimized dual camera features to a wider range of consumers.”
Dual camera smartphones have two image sensors that capture different light information, enabling new features like refocusing and LLS. With these benefits, dual cameras are a growing trend in premium mobile devices. However, integrating dual cameras can be a difficult process for original equipment manufacturers (OEM), as it requires time-consuming optimization between the OEMs and different vendors developing the sensors and algorithm software. Samsung’s total dual camera solution will simplify that process and enable mid- to entry-level mobile devices to take advantage of certain camera features mainly available in premium devices equipped with an extra image signal processor.
To accelerate development and reduce optimization difficulties with dual camera smartphones, Samsung now offers the industry’s first total dual camera solution, with both ISOCELL Dual sensor hardware and sensor-optimized algorithm software. This enables even mid- to entry-level mobile devices to utilize popular dual camera features like refocusing and LLS. Samsung is coupling its refocusing algorithm with a 13 megapixel (Mp) and 5Mp set of image sensors, and its LLS algorithm with a set of two 8Mp sensors, to simplify implementation by OEMs.
Samsung Electronics, the world leader in advanced memory technology, today announced that it has launched an 800-gigabyte (GB) solid state storage drive—the SZ985 Z-SSD, for the most advanced enterprise applications including supercomputing for AI analysis.
Developed in 2017, the new 800GB Z-SSD provides the most efficient storage solution for high-speed cache data and log data processing, as well as other enterprise storage applications that are being designed to meet rapidly growing demand within the AI, big data and IoT markets.
“With our leading-edge 800GB Z-SSD, we expect to contribute significantly to market introductions of next-generation supercomputing systems in the near future, enabling improved IT investment efficiency and exceptional performance,” said Jinman Han, senior vice president, Memory Product Planning & Application Engineering at Samsung Electronics. “We will continue to develop next-generation Z-SSDs with higher density and greater product competitiveness, in order to lead the industry in accelerating growth of the premium SSD* market.”
The new single port, four-lane Z-SSD features Z-NAND chips that provide 10 times higher cell read performance than 3-bit V-NAND chips, along with 1.5GB LPDDR4 DRAM and a high performance controller. Armed with some of the industry’s most advanced components, the 800GB Z-SSD features 1.7 times faster random read performance at 750K IOPS, and five times less write latency – at 16 microseconds, compared to an NVMe SSD PM963, which is based on 3-bit V-NAND chips. The Z-SSD also delivers a random write speed of up to170K IOPS.
Due to its high reliability, the 800GB Z-SSD guarantees up to 30 drive writes per day (DWPD) for five years, or a total of 42 petabytes. That translates into storing a total of about 8.4 million 5GB-equivalent full-HD movies during a five-year period. The reliability of the new Z-SSD is further underscored by a mean time between failures (MTBF) of two million hours.
Samsung will introduce its new Z-SSD in 800GB and 240GB versions, as well as related technologies at ISSCC 2018 (International Solid-State Circuits Conference), which will be held February 11-15 in San Francisco.
Note: All brand, product, service names and logos are trademarks and/or registered trademarks of their respective owners and are hereby recognized and acknowledged. Z-SSD is a trademark of Samsung Electronics Co., Ltd.
* Editor’s Note: The premium SSD means an SSD with IOPs exceeding 550K for random reads, and latency lower than 20us.